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Panasonic Solar to Evaluate Meyer Burger’s SmartWire Connection Technology

Considering for the manufacture of its high efficiency solar modules.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

Meyer Burger Technology Ltd announced an agreement with Panasonic Solar for the installation and accelerated evaluation of its SWCT platform for the connection of HIT cells.
 
With its heterojunction cell technology, Panasonic is one of the pioneers in the development and manufacture of high efficiency solar cells and modules. By implementing Meyer Burger’s SmartWire Connection technology to connect its HIT cells, Panasonic expects to further increase the strength of its high efficiency PV modules.
 
Meyer Burger’s SmartWire Connection Technology employs an innovative foil-wire electrode with up to 24 perfectly aligned wires to connect solar cells. This reduces silver consumption per heterojunction solar module by over 50%, which in turn reduces production costs for solar module manufacturers.
 
The resulting dense wire contact matrix enables SWCT modules to easily cope with the increased power extraction necessary for today’s high efficiency heterojunction solar cells, thereby delivering an increased performance yield in SWCT solar modules. The resulting structure of a SWCT module significantly strengthens its stability and enhances its lifetime.
 
Panasonic-produced HIT PV modules have a unique silicon heterojunction structure composed of crystalline silicon substrate and amorphous silicon layers. This technology performs the junction formation needed for solar cells by surrounding the crystalline silicon wafer with an amorphous silicon layer. With industry-leading conversion efficiency and excellent temperature coefficient characteristics, Panasonic achieves high power generation even in a limited space. Panasonic has started to supply HIT™ cells with partners in addition to PV modules.
 
The delivery and installation of Meyer Burger’s SWCT equipment at Panasonic’s R&D facility located in Osaka, Japan is planned in the second quarter of 2018.

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